FBGA芯片XC7A200T-1FBG676C现货库存XC7A200T-1FBG676C供应商,Xilinx,赛灵思,XC7A200T-1FBG676C规格书参数,类别:嵌入式类,FPGA芯片,可现场编程门阵列;一站式电子元器件服务
lab/clb 数:16825
逻辑元件/单元数:215360
总 ram 位数:13455360
i/o 数:400
栅极数:
电压 - 电源:0.95V ~ 1.05V
安装类型:表面贴装型
工作温度:0°C ~ 85°C（TJ）
封装/外壳:676-BBGA，FCBGA
供应商器件封装:676-FCBGA（27X27）
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